小型高電圧リレーは、信頼性の高いスイッチング特性と高い絶縁特性をコンパクトな設計で実現しています。バッテリーマネジメントシステムにおける絶縁測定など、低リーク電流が要求される厳しいアプリケーション向けに設計されています。
国際規格IEC 60664-1、ISO 6469-3、IEC 60601-1、IEC 62109-1/2に準拠した沿面距離とクリアランスを確保。
SMDタイプで、内部にはんだ接合部がないため、リフローはんだ付けに対応しています。
AEC-Q200, UL Approved, RoHS/REACHに準拠してテストされています。
The MFS series reed relay is an ultra-compact and lightweight option designed for high-density PCB mounting. It can be easily installed in narrow spaces, making it ideal for high-density market demands. The MFS series offers 1 Form A, 2 Form A, and 1 Form C (SPDT) relay options, making it suitable for load board applications and high-density switching matrices.
The MF series reed relay is an ultra-high density vertical square shape for high density PCB assembly, which has the smallest surface size of 4.35mm x 4.35mm in our product line. The size allows you to meet the KGD demands of the IC industry by mounting 500 relays on an 8” board and 1000 relays on a 12” board.
We also offer additional options such as single/double shield and relay sockets for easy maintenance. Please contact our sales engineers for more details.
The MH series reed relay is a miniature vertical 1 Form C surface mount relay. This relay series offers a higher contact rating, compact mounting area, and high reliability with its 1 Form C configuration, utilizing our renowned 1 Form A + 1 Form B technology. Its standard magnetic field feature minimizes magnetic interference, making it suitable for high-density boards. This relay is ideal for ATE, measurement equipment, and telecommunications.
The MT series reed relay is a high-density surface mount changeover-like form design. This MT series was engineered specifically for ATE pin-electronics differential applications. These relays are available in a single SMT package with a 25% reduction in assembly space compared to existing Sanyu brand SMT product line. The MT series surface mount 1 and 2 Form C (A+B) offer exceptional performance, reliability, and credibility. These high-density surface mount relays come in various packaging styles, including Gull-Wing and J-Lead.
超小型 8 端子低プロファイルスルーホール実装 (THT) RM05-8A-SP シリーズリードリレーモジュールは、デュアルインライン (DIL) ピンアウト (2mm ラスター) および高密度基板実装に適する磁気シールドを装備しています。8 チャンネルリレードライバーを装備し、キックバック保護および並列アクティベーション電子回路付きの MAX4823 を装備しています。PCB スペースを大幅に削減するために設計されており、弊社の RM05-8A よりも 24% 小型で、配線コストおよび組み立てコストを節約できます。
The C Series reed relay is a 1 Form A features excellent shielding and 5 GHz performance, with an optional version up to 7 GHz RF. Compared to the M series, this high-density, low-height series offers a 10% reduction in size while maintaining the same excellent reliability. The C Series has a long product life that is widely accepted by the ATE, telecommunications and wireless markets, which require higher frequency and high-density assembly.
The U Series reed relays offer the smallest SMD mounting area while delivering 8 GHz performance. The concept of the U Series is to maintain both miniature package size and higher frequency capability. This series extended its legitimate bandwidth up to 8GHz. This series is available in a J-Lead packaging style. The U Series is suitable for the ATE, telecommunications and wireless markets, which require higher frequency and high-density assembly.
シングルインライン SIL RF シリーズ高周波リードリレーは、DC から 1.5GHz までのスイッチング信号に対応できます。この計装グレードの RF リードリレーは、堅牢な熱硬化性オーバーモールドパッケージで提供されます。必要な PCB 面積は最小で、弊社の DIP および DIL シリーズと比較してわずか 50% です。絶縁耐力 4kVDC が可能で、ダイオードおよび磁気シールドをオプション指定できます。
小型高電圧リレーは、信頼性の高いスイッチング特性と高い絶縁特性をコンパクトな設計で実現しています。バッテリーマネジメントシステムにおける絶縁測定など、低リーク電流が要求される厳しいアプリケーション向けに設計されています。
国際規格IEC 60664-1、ISO 6469-3、IEC 60601-1、IEC 62109-1/2に準拠した沿面距離とクリアランスを確保。
SMDタイプで、内部にはんだ接合部がないため、リフローはんだ付けに対応しています。
AEC-Q200, UL Approved, RoHS/REACHに準拠してテストされています。
The MFS series reed relay is an ultra-compact and lightweight option designed for high-density PCB mounting. It can be easily installed in narrow spaces, making it ideal for high-density market demands. The MFS series offers 1 Form A, 2 Form A, and 1 Form C (SPDT) relay options, making it suitable for load board applications and high-density switching matrices.
The MF series reed relay is an ultra-high density vertical square shape for high density PCB assembly, which has the smallest surface size of 4.35mm x 4.35mm in our product line. The size allows you to meet the KGD demands of the IC industry by mounting 500 relays on an 8” board and 1000 relays on a 12” board.
We also offer additional options such as single/double shield and relay sockets for easy maintenance. Please contact our sales engineers for more details.
The MH series reed relay is a miniature vertical 1 Form C surface mount relay. This relay series offers a higher contact rating, compact mounting area, and high reliability with its 1 Form C configuration, utilizing our renowned 1 Form A + 1 Form B technology. Its standard magnetic field feature minimizes magnetic interference, making it suitable for high-density boards. This relay is ideal for ATE, measurement equipment, and telecommunications.
The MT series reed relay is a high-density surface mount changeover-like form design. This MT series was engineered specifically for ATE pin-electronics differential applications. These relays are available in a single SMT package with a 25% reduction in assembly space compared to existing Sanyu brand SMT product line. The MT series surface mount 1 and 2 Form C (A+B) offer exceptional performance, reliability, and credibility. These high-density surface mount relays come in various packaging styles, including Gull-Wing and J-Lead.
The C Series reed relay is a 1 Form A features excellent shielding and 5 GHz performance, with an optional version up to 7 GHz RF. Compared to the M series, this high-density, low-height series offers a 10% reduction in size while maintaining the same excellent reliability. The C Series has a long product life that is widely accepted by the ATE, telecommunications and wireless markets, which require higher frequency and high-density assembly.
The U Series reed relays offer the smallest SMD mounting area while delivering 8 GHz performance. The concept of the U Series is to maintain both miniature package size and higher frequency capability. This series extended its legitimate bandwidth up to 8GHz. This series is available in a J-Lead packaging style. The U Series is suitable for the ATE, telecommunications and wireless markets, which require higher frequency and high-density assembly.
The MFS series reed relay is an ultra-compact and lightweight option designed for high-density PCB mounting. It can be easily installed in narrow spaces, making it ideal for high-density market demands. The MFS series offers 1 Form A, 2 Form A, and 1 Form C (SPDT) relay options, making it suitable for load board applications and high-density switching matrices.
The MF series reed relay is an ultra-high density vertical square shape for high density PCB assembly, which has the smallest surface size of 4.35mm x 4.35mm in our product line. The size allows you to meet the KGD demands of the IC industry by mounting 500 relays on an 8” board and 1000 relays on a 12” board.
We also offer additional options such as single/double shield and relay sockets for easy maintenance. Please contact our sales engineers for more details.
The MH series reed relay is a miniature vertical 1 Form C surface mount relay. This relay series offers a higher contact rating, compact mounting area, and high reliability with its 1 Form C configuration, utilizing our renowned 1 Form A + 1 Form B technology. Its standard magnetic field feature minimizes magnetic interference, making it suitable for high-density boards. This relay is ideal for ATE, measurement equipment, and telecommunications.
The MT series reed relay is a high-density surface mount changeover-like form design. This MT series was engineered specifically for ATE pin-electronics differential applications. These relays are available in a single SMT package with a 25% reduction in assembly space compared to existing Sanyu brand SMT product line. The MT series surface mount 1 and 2 Form C (A+B) offer exceptional performance, reliability, and credibility. These high-density surface mount relays come in various packaging styles, including Gull-Wing and J-Lead.
The C Series reed relay is a 1 Form A features excellent shielding and 5 GHz performance, with an optional version up to 7 GHz RF. Compared to the M series, this high-density, low-height series offers a 10% reduction in size while maintaining the same excellent reliability. The C Series has a long product life that is widely accepted by the ATE, telecommunications and wireless markets, which require higher frequency and high-density assembly.
The U Series reed relays offer the smallest SMD mounting area while delivering 8 GHz performance. The concept of the U Series is to maintain both miniature package size and higher frequency capability. This series extended its legitimate bandwidth up to 8GHz. This series is available in a J-Lead packaging style. The U Series is suitable for the ATE, telecommunications and wireless markets, which require higher frequency and high-density assembly.
超小型 8 端子低プロファイルスルーホール実装 (THT) RM05-8A-SP シリーズリードリレーモジュールは、デュアルインライン (DIL) ピンアウト (2mm ラスター) および高密度基板実装に適する磁気シールドを装備しています。8 チャンネルリレードライバーを装備し、キックバック保護および並列アクティベーション電子回路付きの MAX4823 を装備しています。PCB スペースを大幅に削減するために設計されており、弊社の RM05-8A よりも 24% 小型で、配線コストおよび組み立てコストを節約できます。
シングルインライン SIL RF シリーズ高周波リードリレーは、DC から 1.5GHz までのスイッチング信号に対応できます。この計装グレードの RF リードリレーは、堅牢な熱硬化性オーバーモールドパッケージで提供されます。必要な PCB 面積は最小で、弊社の DIP および DIL シリーズと比較してわずか 50% です。絶縁耐力 4kVDC が可能で、ダイオードおよび磁気シールドをオプション指定できます。
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