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RM05-8A-SP シリーズリードリレー

概要

超小型 8 端子低プロファイルスルーホール実装 (THT) RM05-8A-SP シリーズリードリレーモジュールは、デュアルインライン (DIL) ピンアウト (2mm ラスター) および高密度基板実装に適する磁気シールドを装備しています。8 チャンネルリレードライバーを装備し、キックバック保護および並列アクティベーション電子回路付きの MAX4823 を装備しています。PCB スペースを大幅に削減するために設計されており、弊社の RM05-8A よりも 24% 小型で、配線コストおよび組み立てコストを節約できます。

仕様

コイル電圧 (VDC)5
コイル抵抗 (Ω)500
接点フォーム8A
最大定格10W/170VDC/0.5A

アプリケーション

テストおよび測定、自動テスト装置 (ATE)、高密度基板実装

シリーズデータシート(PDF)
 
印刷

在庫チェック

アイテム番号データシート代理店地域数量チャート見積依頼Inventory Date
RM05-8A-SP Digi-Key ElectronicsAmericas0 見積依頼2023-08-01
RM05-8A-SP Standex FactoryAmericas0 見積依頼2024-04-16
RM05-8A-SP Mouser ElectronicsAmericas10 購入する 見積依頼2024-04-16
RM05-8A-SP TTI Inc Global HeadquartersAmericas0 見積依頼2024-04-16

パラメータ検索

コイル電圧スイッチおよび接点フォーム接点形状接点容量開閉電圧組込形状オプション特殊機能
部品番号コイル電圧スイッチおよび接点フォーム接点形状接点容量開閉電圧実装オプション特殊機能
RM05-8A-SP58A8PST-NO< 10 W< 200 VDCThrough Hole (THT)Diode & Magnetische AbschirmungIntegriertes Schieberegister

関連製品

CRF シリーズは超小型 7GHz 高周波リードリレーであり、低プロファイル表面実装 (SMD) パッケージ型になっています。RF リードリレーは、標準値 10^13 Ω の高い絶縁抵抗 (IR) を持ち、セラミック基板と堅牢な熱硬化性オーバーモールドパッケージで提供されます。IEC 286/part 3 準拠のテープ&リールで供給されます。UL 認定済み。

UL Certificate of Compliance

HF シリーズ高周波リードリレーおよび高電圧リードリレーは、5A@30MHz の電流を通電できます。特別にパッケージされたコイルを装備し、PCB ピンはコイル専用です。この高周波リードリレーのスイッチ接点は、直接配線用に使用できます 。特許取得済みの外部静電および磁気シールドを装備しています。RF リードリレーの接点間耐電圧は最大 9kVDC です。

シングルインライン SIL RF シリーズ高周波リードリレーは、DC から 1.5GHz までのスイッチング信号に対応できます。この計装グレードの RF リードリレーは、堅牢な熱硬化性オーバーモールドパッケージで提供されます。必要な PCB 面積は最小で、弊社の DIP および DIL シリーズと比較してわずか 50% です。絶縁耐力 4kVDC が可能で、ダイオードおよび磁気シールドをオプション指定できます。

テクニカルペーパー

アプリケーション

メディア

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