Surface mount reed relay designs are simpler and generally have fewer internal components. They are generally smaller, allowing them to take up less board space while meeting the critical board space cost aspects. In modern printed circuit board (PCB) manufacturing facilities surface mounting technology has become the dominant approach for component assemblies. Choose from high voltage, high frequency and relay modules low-profile over-molded reed relays, available with or without BGA (Ball Grid Arrays) and suitable for pick and place and surface mount soldering.
Ultraminiature surface mount (SMD) low-profile CRR Series Reed Relay with high insulation resistance (IR) typical 10^13 Ω. Instrumentation grade relay comes in a rugged thermoset overmolded package with ceramic substrate. Supplied in tape and reel according to IEC 286/part 3. Ball grid array (BGA) optional. UL approval.
The CRF Series is an ultraminiature 7GHz (RF) high frequency reed relay design in a low-profile surface mount (SMD) package. The RF reed relay features a high insulation resistance (IR) typical 10^13 Ω. This instrumentation grade relay comes in a rugged thermoset overmolded package with ceramic substrate. Supplied in tape and reel according to IEC 286/part 3. Ball grid array (BGA) optional. UL approval.
The KT series high voltage reed relay and high insulation reed relay is available in both a surface mount (SMD) or through-hole (THT) design. This high voltage reed relay is capable of switching up to 1kVDC, breakdown voltage of 4.2kVDC, isolation voltage to 7kVDC and features a high insulation resistance (IR) >10^13 Ω. This KT series is supplied in a rugged thermoset overmolded package. Tested in accordance with AEC-Q200, UL listed.
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