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Surface Mount (SMD) Relays |

Surface mount reed relay designs are simpler and generally have fewer internal components. They are generally smaller, allowing them to take up less board space while meeting the critical board space cost aspects. In modern printed circuit board (PCB) manufacturing facilities surface mounting technology has become the dominant approach for component assemblies. Choose from high voltage, high frequency and relay modules low-profile over-molded reed relays, available with or without BGA (Ball Grid Arrays) and suitable for pick and place and surface mount soldering.

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MFS series reed relay

The MFS series reed relay is an ultra-compact and lightweight option designed for high-density PCB mounting. It can be easily installed in narrow spaces, making it ideal for high-density market demands. The MFS series offers 1 Form A, 2 Form A, and 1 Form C (SPDT) relay options, making it suitable for load board applications and high-density switching matrices.

  • SPDT High Density
  • 3.3V, 5V, 12V Coil available
  • Magnetic Shield
  • Smallest Mounting Space: 4.9mm x 4.9mm
  • Electrostatic Shield and Diode Options
MF series reed relay is an ultra-high-density vertical

The MF series reed relay is an ultra-high density vertical square shape for high density PCB assembly, which has the smallest surface size of 4.35mm x 4.35mm in our product line. The size allows you to meet the KGD demands of the IC industry by mounting 500 relays on an 8” board and 1000 relays on a 12” board.

We also offer additional options such as single/double shield and relay sockets for easy maintenance. Please contact our sales engineers for more details.

MH series reed relay

The MH series reed relay is a miniature vertical 1 Form C surface mount relay. This relay series offers a higher contact rating, compact mounting area, and high reliability with its 1 Form C configuration, utilizing our renowned 1 Form A + 1 Form B technology. Its standard magnetic field feature minimizes magnetic interference, making it suitable for high-density boards. This relay is ideal for ATE, measurement equipment, and telecommunications.

  • RF performance to 3 GHz
  • 5 Watt Contact Rating, 50 V Switching capable
  • 300 x 10⁶ cycle
MT series reed relay

The MT series reed relay is a high-density surface mount changeover-like form design. This MT series was engineered specifically for ATE pin-electronics differential applications. These relays are available in a single SMT package with a 25% reduction in assembly space compared to existing Sanyu brand SMT product line. The MT series surface mount 1 and 2 Form C (A+B) offer exceptional performance, reliability, and credibility. These high-density surface mount relays come in various packaging styles, including Gull-Wing and J-Lead.

  • RF Performance up to 4 GHz
  • Impedance 50Ω
  • Reliability > 300 Million
M Series reed relay
The M Series reed relay 1 Form A with excellent shielding and 4 GHz RF performance, with an optional version up to 5.5 GHz. This miniature RF relay is equipped with coaxial shield to maintain 50Ω impedance. It was developed to significantly reduce the mounting area while maintaining a maximum contact capacity of 10W. These high-density surface mount relays come in Gull-Wing and J-Lead packaging. Axial leads or 1500 V dielectric strength upon request. The M Series has a long product life that is widely accepted by the ATE, telecommunications and wireless markets.
C Series reed relay high-density surface mount relay

The C Series reed relay is a 1 Form A features excellent shielding and 5 GHz performance, with an optional version up to 7 GHz RF. Compared to the M series, this high-density, low-height series offers a 10% reduction in size while maintaining the same excellent reliability. The C Series has a long product life that is widely accepted by the ATE, telecommunications and wireless markets, which require higher frequency and high-density assembly.

U Series reed relay high-density surface mount relay

The U Series reed relays offer the smallest SMD mounting area while delivering 8 GHz performance. The concept of the U Series is to maintain both miniature package size and higher frequency capability. This series extended its legitimate bandwidth up to 8GHz. This series is available in a J-Lead packaging style. The U Series is suitable for the ATE, telecommunications and wireless markets, which require higher frequency and high-density assembly.

MHV Series Reed Relay

Miniature high voltage relay combines a reliable switching and high isolation properties with a compact design. Designed for demanding applications such as isolation measurement in Battery Management Systems or any other, where low leakage currents are required.

Creepage and clearance distances consistent with international standards IEC 60664-1, ISO 6469-3, IEC 60601-1 and IEC 62109-1/2.
SMD style with no internal solder joints – reflow soldering compatible.
Tested in accordance with AEC-Q200, UL Approved, RoHS/REACH.

KT Reed Relay

The KT series high voltage reed relay and high insulation reed relay is available in both a surface mount (SMD) or through-hole (THT) design. This high voltage reed relay is capable of switching up to 1kVDC, breakdown voltage of 4.5kVDC, isolation voltage to 7kVDC and features a high insulation resistance (IR) >10^13 Ω. This KT series is supplied in a rugged thermoset overmolded package. Tested in accordance with AEC-Q200, UL listed.

UL Certificate of Compliance

CRR Reed Relay

Ultraminiature surface mount (SMD) low-profile CRR Series Reed Relay with high insulation resistance (IR) typical 10^13 Ω. Instrumentation grade relay comes in a rugged thermoset overmolded package with ceramic substrate. Supplied in tape and reel according to IEC 286/part 3. Ball grid array (BGA) optional. UL approval.

UL Certificate of Compliance

CRF Reed Relay

The CRF Series is an ultraminiature 7GHz (RF) high frequency reed relay design in a low-profile surface mount (SMD) package.  The RF reed relay features a high insulation resistance (IR) typical 10^13 Ω. This instrumentation grade relay comes in a rugged thermoset overmolded package with ceramic substrate. Supplied in tape and reel according to IEC 286/part 3. Ball grid array (BGA) optional. UL approval.

UL Certificate of Compliance

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