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The SHV reed relay is a single in-line and high voltage relay or instrumentation grade reed relay supplied in a molded housing, capable of switching up to 1kVDC and breakdown voltage of 4kVDC. This high voltage reed relay series features an insulation resistance >5 x 10^11 Ω and utilizes minimum PCB area, at only 50% compared to our DIP and DIL reed relay series. It is even smaller than the former potted SIL-HV Reed Relay.

UL – Certificate of Compliance

UMS Reed Relay

Ultraminiature instrumentation grade single in-line (SIL) UMS Series Reed Relay used in very closely stacked matrices. Measure nearly 50% smaller than the standard MS series reed relay. Contains and internal magnetic shield. UL approval.

UL Certificate of Compliance

MS Reed Relay

General purpose micro single in-line (SIL) MS Series Reed Relay with rugged thermoset overmolded package has a standard internal magnetic shield. This instrumentation grade relay can be stacked in close matrices. Available in high frequency version up to 1GHz. Optional diode. UL approval.

UL Certificate of Compliance

SIL Reed Relay

General purpose instrumentation grade single in-line SIL Series Reed Relay is supplied in a rugged thermoset overmolded package. Utilizes minimum PCB area at only 50% compared to our DIP and DIL series. Available with dielectric strength 4kVDC. Optional diode and magnetic shield. UL approval.

UL Certificate of Compliance

Ultraminiature 8-pole low profile through hole mount (THT) RM05-8A-SP Series Reed Relay module with standard dual in-line (DIL) pin-out (2mm raster) and integrated magnetic shield for high density board mounting. Equipped with an 8-channel relay driver with MAX4823 with kickback protection and parallel activation electronics. Designed to significantly reduce PCB space at 24% smaller than our RM05-8A, saves on wiring costs, and assembly costs.

SILRF Reed Relay

The single in-line SIL RF series high frequency reed relay is capable of switching signals from DC to 1.5GHz. This instrumentation grade RF reed relay is supplied in a rugged thermoset overmolded package. Utilizes minimum PCB area at only 50% compared to our DIP and DIL series. Available with dielectric strength 4kVDC. Optional diode and magnetic shield. 

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